To meet the demand for high-density power conversion, Inventchip Technology has introduced two new TC3Pak (Topside Cooling 3Pak) topside-cooling, surface-mount packaged 1200V silicon carbide (SiC) MOSFET products. Featuring low losses and strong heat dissipation, these products enable more compact and efficient system designs, while supporting automated soldering during assembly.

 Currently, two TC3Pak packaged products, IV2Q12040K1Z and IV2Q12080K1Z, have passed automotive-grade reliability certification (AEC-Q101). Utilizing mature Gen-2 SiC MOSFET technology, they are compatible with drive voltages of 15V to 18V and excel in high-frequency switching and low-loss operations.

TC3Pak Topside Cooling Package

Traditional surface-mounted devices rely on PCB heat dissipation or thermal conduction, limiting the high-power application advantages of SiC MOSFETs. The new TC3Pak package allows the top side to directly attach to an external heat sink, eliminating dependence on PCB heat dissipation. This significantly suppresses temperature rise in SiC MOSFETs, enabling systems to operate at higher power with greater reliability.

 The TC3Pak package incorporates a Kelvin source pin, effectively suppressing drive voltage spikes and reducing switching losses. This helps unleash the high-frequency switching advantages of SiC MOSFETs, further enhancing system efficiency.

 With a compact form factor and support for surface mounting, the TC3Pak package is easy to install, as shown in the diagram:

Main Applications

The 1200V SiC MOSFETs in TC3Pak packages, characterized by high voltage resistance, low losses, high-frequency switching, and excellent heat dissipation, are primarily suitable for high-efficiency and high-density applications such as:

· On-board chargers

· On-board DC/DC converters

· On-board air compressor controllers

· Photovoltaic inverters

· AC/DC power supplies